OLED Encapsulation Report


This research was prepared through the analysis of the information attained by interviewing the panel manufacturers, equipment companies, material and research institute personnel, and data acquired with organizers’ consents as personally participating in various conferences and exhibitions in company with the UBI Research’s OLED related data base assets accumulated over the period of more than ten years.

The market prospect data in this report was simulated based on the UBI Research database considering the panel company’s investment trend, production capacity, process technology level, soluble OLED material performance, and printing equipment development level of the equipment company.

Key points

Encapsulation is essential to prevent luminescent and electrode materials from being oxidized as it blocks moisture and oxygen flowing in from the outside of OLED element, and protects elements from mechanical and physical impacts from outside.

The rigid AMOLED which is currently mass-produced for a mobile device is employing the frit glass method while the flexible AMOLED takes the hybrid and TFE methods, and a panel for AMOLED TV takes hybrid methods.

The frit glass method has a perfect encapsulation capacity but it is hard to be applied to a large area and flexible AMOLED whereas the TFE is adequate for a flexible but difficult for a large area due to the complicated process of forming a multilayer thin film, the occurrence of particle, and the problem of film uniformity.

However, the hybrid encapsulation is applicable for both a large area and flexible OLEDs with the advantage that the number of process is less than that of TFE. It is analyzed that the hybrid encapsulation using a transparent gas barrier can be applied to a ridged AMOLED panel for a mobile device for the benefits such as prevention of breaks and reduction of thickness. Therefore, the hybrid encapsulation is expected to be a core encapsulation technology appropriate for all kinds of OLED panels.

The luminescent material is necessary to improve its performance or change into the top emission as a TV requires high resolution over UHD and the high brightness more than 500nit. The transparent gas barrier is expected to be adopted for the top emission as an opaque film like a metal foil cannot be applied.

Flexible AMOLED will be proceeded with the foldable/rollable type in the curved/bendable type. It is analyzed that a transparent gas barrier is to be applied as a cover window used for curved/bendable type is not applicable to the foldable/rollable type.

Thin film encapsulation (TFE) is employed for mass production. The technology less than three layers (1.5dyads) is required for increasing occurrence of particles, process hours and investment cost as more layers are stacked. When it is difficult to acquire sufficient WVTR features with the TFE under 1.5dyads, a gas barrier film will be required and it has no choice but to be converted into the hybrid encapsulation structure. In this sense, the key encapsulation technology is expected to be of hybrid method and it is necessary to develop a transparent gas barrier satisfying conditions including flexible, large area, transmittance and WVTR.

The AMOLED panel market applying the hybrid method is prospected to be US$ 1,215 million in the entire AMOLED panel market of 2015.

The entire OLED Encapsulation equipment market will be total US$ 5 billion for six years from 2015 to 2020.

The main materials applied to the hybrid encapsulation are metal foil, transparent gas barrier, and organic material, expected to form a market of US$ 60 million in 2015.


– Executive summary
Summarized a large body of material to enable to rapidly become acquainted with main issues of the report

– Introduction
Clarified the definition, classification and basic process of encapsulation technology to the point

– Encapsulation Issue Analysis
Analyzed latest OLED encapsulation related major issues and covered encapsulation trends per application

– Encapsulation History Analysis
The features of materials and applications were analyzed with the course of time for each TFE(Thin Film Encapsulation), hybrid encapsulation, and can encapsulation. In addition, the encapsulation technology development history of major AMOLED panel manufacturers were analyzed to predict the future trends in technology.

– Encapsulation Technology trend analysis
It is possible to comprehend the trends of the overall OLED encapsulation industry as covering the trends in the latest encapsulation technology of major panel/equipment/material companies. Furthermore, it offers information as to equipment and materials in use by analyzing the detailed encapsulation processes of major panel manufacturers.

– Encapsulation Supply Chain analysis
The supply chains of Samsung Display and LG Display were analyzed regarding the encapsulation technology related equipment and materials suppliers.

– Encapsulation Road map analysis
The roadmap for the encapsulation technology which is applied to the rigid AMOLED, large area AMOLED, and flexible AMOLED were predicted according to the characteristics such as resolution, size and structure.

– AMOLED Panel Market Forecast by Encapsulation Technology
Encapsulation Equipment Market Forecast
Encapsulation Material Market Forecast
The AMOLED panel market, encapsulation equipment market and encapsulation materials market per eacg encapsulation technology from 2015 to 2020 were forecasted. It is possible to identify the detailed market for equipment and AMOLED panel from the key materials applied to the encapsulation.

Format : PDF / Page : 93p / Updated : 2015. 1




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